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Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology, Ltd. Professional TIM Manufacturer
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Dielectric Constant 7.0Mhz CPU Thermal Pad Soft Compressible For Memory Modules

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Dielectric Constant 7.0Mhz CPU Thermal Pad Soft Compressible For Memory Modules

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Brand Name : Ziitek

Model Number : TIF100-30-05US

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 24*13*12cm cartons

Name : Dielectric Constant 7.0Mhz CPU Thermal Pad Soft Compressible For Memory Modules

Color : Blue

Dielectric constant@1MHz : 7.0MHz

Thermal conductivity : 3.0W/mK

Application : CPU ,GPU, Memory Modules

Keyword : CPU Thermal Pad

Recommended Operating Temperature (°C) : -40 to 200℃

Density : 3.0g/cm³

Hardness : 50/20 Shore 00

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Dielectric Constant 7.0Mhz CPU Thermal Pad Soft Compressible For Memory Modules

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Products description

Ziitek TIF®100-30-05US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features

> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Mainboard/mother board

> Notebook

> Power supply

> Heat pipe thermal solutions

> Memory Modules

> Mass storage devices

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card

> Motherboard chip
> Radiator
> AI Processors AI Servers

Typical Properties of TIF®100-30-05US Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 50 Shore 00 20 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 3.0 ASTM D5470
3.0 ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1(Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Dielectric Constant 7.0Mhz CPU Thermal Pad Soft Compressible For Memory Modules
Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Dielectric Constant 7.0Mhz CPU Thermal Pad Soft Compressible For Memory Modules
FAQ

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.


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