Sign In | Join Free | My ledscreensign.com
China Dongguan Ziitek Electronical Material and Technology Ltd. logo
Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer
Verified Supplier

7 Years

Home > Silicone Thermal Pad >

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram

Dongguan Ziitek Electronical Material and Technology Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram

Brand Name : Ziitek

Model Number : TIF100-10-02F Series

Certification : RoHS and UL recognized

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram

Thinkness range : 0.020"(0.5mm)~0.200" (5.0mm)

Sample : Sample Avaliable

Flam rating : 94 V0

Hardness : 60 Shore 00

Thermal Conductivity : 1.0W/mK

Color : Gray

Keywords : Silicone Thermal Pads

Contact Now

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Product description

TIF100-10-02F Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features

> Good thermal conductive : 1.0W/mK
> Soft and Compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thickness

> Easy release construction
> Electrically isolating
> High durability

Applications


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Display card
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

Typical Properties of TIF100-10-02F Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer *******
Specific Gravity 2.3g/cc ASTM D297
Thickness range 0.020"(0.5mm)~0.200" (5.0mm) ASTM C351
Hardness (thickness ≥1.0mm) 60 Shore 00 ASTM 2240
Dielectric Breakdown Voltage >5500 VAC ASTM D412
Operating Temp -40 ~160℃ *******
Dielectric Constant 4.0 MHz ASTM D150
Volume Resistivity 1.0X1012Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 1.0W/mK ASTM D5470
Outgassing(TML) 0.35% ASTM E595

Product Specification


Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.


Product Tags:

silicone thermal pad for CPU GPU

      

electrical insulation thermal gap filler

      

0.5 to 5.0mm thermal pad

      
Quality Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram for sale

Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Dongguan Ziitek Electronical Material and Technology Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)