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8.0W Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Thermal Pad In Roll for Medical Devices

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Dongguan Ziitek Electronical Material and Technology Ltd.

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8.0W Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Thermal Pad In Roll for Medical Devices

Name: 80W Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 15mm Thermal Transfer Thermal Pad In Roll for Medical Devices
Brand: Ziitek
Price: 0.1 USD

Quality 8.0W Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Thermal Pad In Roll for Medical Devices for sale

Brand Name : Ziitek

Model Number : TIF760HQ Series

Certification : RoHS and UL recognized

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : 8.0W Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Thermal Pad In Roll for Medical Devices

Thinkness range : 1.5mmT

Sample : Sample Avaliable

Flam rating : 94 V0

Hardness : 45±5 Shore 00

Thermal Conductivity : 8.0 W/mK

Color : Gray

Keywords : Thermal Pad

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8.0W Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Thermal Pad In Roll for Medical Devices

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

TIF760HQ is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features

> Good thermal conductive : 8.0W/mK
> Soft and Compressible for low stress applications
> High tack surface reduces contact resistance
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of TIF760HQ Series
Color	Gray	Visual
Construction & Compostion	Ceramic filled silicone elastomer	*******
Specific Gravity	3.5g/cc	ASTM D297
Thickness range	1.5mm	ASTM C351
Hardness (thickness ≥1.0mm)	45±5 Shore 00	ASTM 2240
Hardness (thickness ＜1.0mm)	55±5 Shore 00	ASTM 2240
Dielectric Breakdown Voltage	>5500 VAC	ASTM D412
Operating Temp	-45 ~200℃	*******
Dielectric Constant	5.0 MHz	ASTM D150
Volume Resistivity	1.0X10¹²Ohm-meter	ASTM D257
Fire rating	94 V0	equivalent UL
Thermal conductivity	8.0W/mK	ASTM D5470

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming
Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

8.0W Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Thermal Pad In Roll for Medical Devices

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Product Tags:

8.0W Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Thermal Pad In Roll for Medical Devices Images

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8.0W Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Thermal Pad In Roll for Medical Devices

8.0W Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Thermal Pad In Roll for Medical Devices

1.5mm thermal pad for medical devices

silicone thermal pad with heat dissipation

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8.0W Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Thermal Pad In Roll for Medical Devices Images